Process material solutions for semiconductor manufacturing, advanced packaging, IC substrates, PCB/FPC and display manufacturing.
01SEMICONDUCTOR MANUFACTURING SOLUTIONS
Validated functional tapes and protection materials for wafer back grinding, dicing and surface protection.
02ADVANCED PACKAGING SOLUTIONS
Material matching and application validation for die attach, package dicing and temporary fixing processes.
03IC SUBSTRATE MANUFACTURING SOLUTIONS
Materials for substrate dicing, elevated-temperature processes and surface protection in fine-line manufacturing.
04PCB & FPC MANUFACTURING SOLUTIONS
Material portfolios and application support for plating, high-temperature processing, protection and precision lamination in PCB and FPC manufacturing.
05DISPLAY MANUFACTURING SOLUTIONS
Clean and stable functional materials for panel processing, temporary fixing and surface protection.
