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Functional Materials for Precision Electronics Processes

Functional Materials for Precision Electronics Processes

Products are classified by application and supported from material selection through validation and volume qualification.

背磨胶带 Back Grinding Tape

Back Grinding Tape

背磨胶带

Semiconductor
晶圆切割胶带 Wafer Dicing Tape

Wafer Dicing Tape

晶圆切割胶带

SemiconductorAdvanced Packaging
芯片贴装膜（DAF） Die Attach Film (DAF)

Die Attach Film (DAF)

芯片贴装膜（DAF）

Advanced Packaging
封装切割胶带 Package Dicing Tape

Package Dicing Tape

封装切割胶带

PackagingIC Substrate
耐高温胶带（PI） Heat Resistant Tape (PI)

Heat Resistant Tape (PI)

耐高温胶带（PI）

SemiconductorPCBFPC
制程保护膜 Process Protection Film

Process Protection Film

制程保护膜

SemiconductorPCB
临时固定胶带 Temporary Fixing Tape

Temporary Fixing Tape

临时固定胶带

PCBElectronic Manufacturing
双面胶带 Double Sided Tape

Double Sided Tape

双面胶带

Electronic Assembly