Understand the Process
Review the process step, substrate, temperature and operating conditions to define adhesion, protection and release requirements.
Advanced Electronic Process Materials Supplier
HXC focuses on functional films and adhesive materials, supporting semiconductor and precision electronics manufacturers with R&D, manufacturing and application services.
About HXC
HXC Semiconductor Materials focuses on the development, manufacturing and application service of functional films and adhesive materials for advanced electronics processes, supporting semiconductor manufacturing, advanced packaging, IC substrates, PCB/FPC and display manufacturing with product selection, process matching, sample validation, process optimization and volume supply.
Our functional tapes and films address grinding, dicing, die attachment, protection and temporary fixing. Material selection considers not only adhesion, but also the substrate, processing temperature, lamination method and subsequent release conditions to assess compatibility with the intended process.
01Advanced Electronic Process Materials
02Semiconductor & PCB/FPC Applications
03Material Selection & Process Matching
04Sample Validation & Volume Qualification
Industries We Serve
Semiconductor Manufacturing
Wafer back grinding, dicing, surface protection and clean release.
Advanced PackagingDie attach, package dicing, temporary fixing and precision assembly.
IC SubstrateFine-line processing, substrate dicing, elevated-temperature processing and surface protection.
PCB ManufacturingPlating protection, high-temperature processing, process protection, precision lamination and FPC manufacturing.
Display ManufacturingPanel processing, temporary fixing, surface protection and clean release.
Our Materials Portfolio
From wafer processing to electronics manufacturing, our portfolio supports material selection for different process steps. Grades, performance and suitability are subject to product documentation and application validation.
Back Grinding Tape
Semiconductor
Wafer Dicing Tape
Semiconductor / Advanced Packaging
Die Attach Film (DAF)
Advanced Packaging
Package Dicing Tape
Packaging / IC Substrate
Heat Resistant Tape (PI)
Semiconductor / PCB / FPC
Process Protection Film
Semiconductor / PCB
Temporary Fixing Tape
PCB / Electronic Manufacturing
Double Sided Tape
Electronic Assembly
From Requirements to Application Validation
Select the Material
Use product documentation to shortlist materials, agree specifications and handling methods, and define sample evaluation objectives.
Validate the Application
Evaluate material performance under actual operating conditions, refine selection from feedback and discuss subsequent supply requirements.
Company Addresses
Room 337, Qianhai Technology Innovation Center, Xixiang Avenue, Bao'an District, Shenzhen, China
Building 24, Zhongnan Hi-Tech Industrial Park, Xinhang Road, Siqian Town, Xinhui District, Jiangmen, China
No. 15 Chuangye Avenue, Gaogang District, Taizhou, Jiangsu, China