300 mm wafer on precision cleanroom equipment

ADVANCED SEMICONDUCTOR & ELECTRONIC PROCESS MATERIALS

Advanced Semiconductor & Electronic Process MaterialsEnabling High-End Manufacturing

High-performance adhesive materials, functional films and process solutions for semiconductors, advanced packaging, IC substrates and PCB/FPC manufacturing.

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Solutions

SOLUTIONS

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01Semiconductor Manufacturing半导体制造

Validated functional tapes and protection materials for wafer back grinding, dicing and surface protection.

02Advanced Packaging先进封装

Material matching and application validation for die attach, package dicing and temporary fixing processes.

03IC SubstrateIC载板

Materials for substrate dicing, elevated-temperature processes and surface protection in fine-line manufacturing.

04PCB & FPC ManufacturingPCB / FPC制造

Material portfolios and application support for plating, high-temperature processing, protection and precision lamination in PCB and FPC manufacturing.

Product Center

PRODUCT CENTER

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Back Grinding Tape背磨胶带Semiconductor→

Wafer Dicing Tape晶圆切割胶带Semiconductor / Advanced Packaging→

Die Attach Film (DAF)芯片贴装膜（DAF）Advanced Packaging→

Package Dicing Tape封装切割胶带Packaging / IC Substrate→

Heat Resistant Tape (PI)耐高温胶带（PI）Semiconductor / PCB / FPC→

Process Protection Film制程保护膜Semiconductor / PCB→

Application Fields

APPLICATIONS

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Semiconductor Manufacturing半导体制造→

Advanced Packaging先进封装→

IC SubstrateIC载板制造→

PCB ManufacturingPCB/FPC制造→

Display Manufacturing显示制造→

Technology & Innovation

TECHNOLOGY & INNOVATION

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Material Technology for Advanced Processes

Continuous development of adhesive systems, functional films and process compatibility supports the cleanliness, reliability and stability demanded by advanced manufacturing.

01Material Engineering材料研发

02Adhesive Technology胶黏技术

03Process Compatibility制程兼容

04Application Validation应用验证

Technology & Innovation