Applications across Advanced Electronics Manufacturing

Functional tapes, films and application support for five core advanced electronics industries.

Semiconductor Manufacturing

半导体制造

Wafer back grinding, dicing, surface protection and clean release.

先进封装

Die attach, package dicing, temporary fixing and precision assembly.

IC载板制造

Fine-line processing, substrate dicing, elevated-temperature processing and surface protection.

PCB/FPC制造

Plating protection, high-temperature processing, process protection, precision lamination and FPC manufacturing.

显示制造

Panel processing, temporary fixing, surface protection and clean release.