Solutions

Materials matched to process conditions

From wafer preparation to package singulation, we focus on stable bonding, protection and clean de-bonding.

UC1010 · UC1020 · UC1100 · UN1003

Wafer Grinding Tape

Controls tape tension, conformability and thickness uniformity to reduce wafer warpage, cracking and grinding-fluid contamination.

UC2104 · UC2100 · UC2073 · UN2008

High tack prevents die fly-off, elongation supports stable expansion, and de-bonding leaves a clean surface.

CB1001

Maintains stable bonding through dicing, pick-up and packaging while supporting heat resistance and dimensional stability.

TF3025S · TF3015S · TF3020S-4 · TF3033S

Supports pre- and post-applied processes while reducing residue, resin bleed and compound-curing interaction.

TF1011 · TF1013

Masks non-plated areas and helps reduce metal overflow, residue, discoloration and peel-static risk.

TF2002 · TF4001 · TF4002 · NS2002

Heat-stable, resin-blocking and easy to remove, helping prevent impressions and protect subsequent plating.

UC2111-2 · UC2111 · UC2124 · UC2137

High adhesion for uneven package surfaces with no die lift, adhesive strings, film strings or residue.

UC2098 · UN2081 · UC2001 · UC2068

Supports small dies, printed surfaces and multiple cutting methods with stable expansion and clean release.