Process tapes and films organized by release mechanism, thermal performance and application.
High adhesion during processing followed by rapid tack reduction after UV irradiation. Used in wafer grinding, dicing, package singulation and advanced LED processes.
Stable adhesion and clean mechanical release under conventional temperature conditions.
Temperature-triggered release combines strong processing adhesion with low residue during de-bonding.
Heat resistance, low outgassing and resin-barrier performance for QFN, SiP, sputtering and molding.
Silicone-free clean release for molding and silicone-sensitive processes.
Balances heat resistance, dimensional stability, low moisture absorption and die bonding.
